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MOQ : 1
Price : Inquiry Us
Payment Terms : T/T
Supply Ability : 200,000+ m² PCB per Month
Layer : 8 layers
Base Material : FR4 Tg170
Board Thickness : 1.5mm
Construction : 1+6+1
Min. Line Width/Space : 0.1/0.1mm
Surface Treatment : ENIG
Type : Customizable
Application : 5G Communication Equipment
Standard : UL&IPC Standard &ISO
8-layer ENIG HDI PCB High Component Density For 5G Communication Equipment
♦ What is HDI PCB?
HDI (High Density Interconnect) PCB is a high-density circuit board constructed by micro blind buried via technology, and uses a build-up process to achieve three-dimensional interconnection of inner and outer layer circuits. The core of its manufacturing lies in the use of laser drilling and electrochemical hole filling processes to form micron-level conductive paths between layers, so that each layer of circuit can be vertically connected without relying on traditional through holes. Ordinary HDI uses a single-layer structure, while high-end products are stacked through multiple layers, combined with advanced technologies such as stacked holes and laser direct forming, to further improve circuit density and electrical performance.
♦ Characteristics of HDI PCB
♦ Applications of HDI PCB
♦ Technical Parameters
| Item | Spec | 
| Layers | 1~64 | 
| Board Thickness | 0.1mm-10 mm | 
| Material | FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc | 
| Max Panel Size | 800mm×1200mm | 
| Min Hole Size | 0.075mm | 
| Min Line Width/Space | Standard: 3mil(0.075mm) Advance: 2mil | 
| Board Outline Tolerance | 士0.10mm | 
| Insulation Layer Thickness | 0.075mm--5.00mm | 
| Out Layer Copper Thickness | 18um--350um | 
| Drilling Hole (Mechanical) | 17um--175um | 
| Finish Hole (Mechanical) | 17um--175um | 
| Diameter Tolerance (Mechanical) | 0.05mm | 
| Registration (Mechanical) | 0.075mm | 
| Aspect Ratio | 17:01 | 
| Solder Mask Type | LPI | 
| SMT Min. Solder Mask Width | 0.075mm | 
| Min. Solder Mask Clearance | 0.05mm | 
| Plug Hole Diameter | 0.25mm--0.60mm | 
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| ENIG HDI 10 Layer PCB Design High Frequency Density For 5G Communication Equipment Images | 
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